Technology
COLDWARE PASSIVE TWO-PHASE DIRECT TO CHIP COOLING TECHNOLOGY
Our groundbreaking COLDWARE technology unlocks energy efficiency, cost savings, and long-term scalability in the fast-paced, high-reliability environment of the data center industry. This closed-loop liquid cooling technology is implemented with high performance cold plate evaporators and condensers that ensure natural coolant circulation driven by the heat from the processors themselves. Sustainable operations and high rack densities are enabled, while ensuring flexibility, serviceability, and reliability.
COLDWARE is pumpless, waterless, self-regulating, easily serviceable, and requires nearly-zero maintenance due to lower complexity and the use of stable, cost-effective dielectric coolants. COLDWARE reduces operating expenses and drives the data center industry to higher efficiency. Whether you are converting an entire IT infrastructure to liquid cooling or planning upgrades alongside traditional air-cooled racks, COLDWARE is the ideal choice for both new and existing data centers.
COLDWARE Passive Cooling System
It's a Flexible and Scalable Platform
SEGUENTE’s COLDWARE platform leverages the physics of two-phase heat transfer to unlock performance and efficiency gains in the rapidly evolving data center space. Our passive two-phase cooling technology involves distributing a dielectric liquid coolant (does not conduct electricity) directly to the hottest components, such as CPUs & GPUs, in a closed loop for maximum performance with minimum impact on current IT hardware architectures.
- Two-phase cold plates absorb heat by boiling a dielectric coolant at near constant temperature. The resulting low-density liquid/vapor mixture flowing out of the cold plate is transported by buoyancy forces (heat rises!) to a coolant distribution unit (CDU), flexibly integrated with facility cooling infrastructure, to be condensed back to high-density liquid and the cycle starts again.
- This highly scalable process efficiently dissipates heat from the chips at optimal operating temperatures, allowing servers to work at peak performance while minimizing energy consumption and environmental impact in a wide range of computing environments.
Passive Two-Phase DTC Liquid Cooling - How it Works:
Heat Absorption
- Cold Plate Design: Our unique two-phase cold plate (a.k.a. evaporator) is placed in direct contact with CPUs, GPUs, or any other high power IT component and filled with a dielectric coolant from a closed loop flow network.
- Server Activation: When the server powers up, the CPUs and GPUs begin to heat up.
- Heat Transfer Process: Heat transfers via conduction from the chip’s hot transistors through the processor package and an optimized thermal interface to the cold plate.
Phase Change
- Enhanced Mass Flow: The dielectric refrigerant coolant absorbs the transferred heat and begins to boil, transforming into an expanding vapor that generates a powerful mass flow.
- Superior Cooling: Two-phase cold plates excel at cooling chips by leveraging the superior heat transfer performance of boiling.
- Maximum Efficiency: The two-phase loop boiling temperature is controlled by the facility temperature meaning operation can be optimized to minimize electrical power use and water consumption.
Heat Rejection
- Heat Absorption: The heat absorbed from the processor creates a low-density mixture of vapor and liquid that flows up to the condenser.
- Heat Release: In the condenser, the vapor releases the heat absorbed from the processor as it transforms back into liquid.
- Heat Rejection: The released heat can then be transferred to the facility via another dielectric fluid, water, or air through a heat transfer surface.
Recirculation
- Efficient Cooling Cycle: The high-density liquid resulting from the condensation process recirculates back to the cold plate, completing the cooling cycle.
- Gravity-Driven Flow: Fluid recirculation is passive, powered by gravity and heat-mediated density difference between the vapor/liquid mixture flowing to the condenser and the liquid flowing back to the cold plate.
- Dynamic Fluid Movement: As more heat is generated by the processor, more recirculating flow is generated. When the processor stops, the flow stops. As long as there is heat from the processor, there is flow!
ARPA-E COOLERCHIPS
ARPA- E COOLERCHIPS: Making Data Centers Cooler
SEGUENTE Inc., in collaboration with Purdue University and Binghamton University, is making significant strides in their research and development efforts. This collaborative research has yielded outstanding results, showcasing a groundbreaking direct-to-die two-phase cooling solution. This innovative cooling technology is designed to significantly enhance overall thermal performance while simultaneously reducing pumping power requirements.
The project is exploring advanced topology optimization algorithms for the design of the cooling structure to ensure maximum efficiency and performance. A novel on-chip direct printing method leveraging laser powder bed fusion is being used to fabricate multi-porosity wicks, which are crucial for effective heat dissipation. To link the fluidically link the wicks to the cooling system level, an additively manufactured multi-input/multi-output fluid distribution manifold has been designed to optimize fluid flow and distribution across the chip.
These advancements represent a major leap forward in thermal management solutions, promising to revolutionize the industry with their superior performance and efficiency as processor powers continue to scale.
Reliable
Cost-Effective
Cost-Effective
Pumpless and water-less thermal management system powered and self-regulated by gravity and heat from processors
Cost-Effective
Cost-Effective
Cost-Effective
Streamlined solution without active pumping or control system enables nearly zero-cooling OPEX and low-CAPEX reducing TCO
Efficient
Cost-Effective
Efficient
Best-in-class thermal performance suitable for the latest processors from all major chip manufacturers, including Intel, AMD and NVIDIA.
Flexible
Sustainable
Sustainable
Dovetail with a wide range of facility level heat rejection methods for legacy and new data centers
Sustainable
Sustainable
Sustainable
Use of low global warming potential coolants with performance enabling zero water usage